The following is issued on behalf of the Hong Kong Monetary Authority:
Result of the tenders of RMB Sovereign Bonds held on August 2, 2023:
Tender Result | ||
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Tender Date | : | August 2, 2023 |
Bonds available for Tender | : | 5-year RMB Bonds |
Issue Number | : | BCMKFB23019 |
Issue and Settlement Date | : | August 4, 2023 |
Maturity Date | : | August 4, 2028 (or the closest coupon payment date) |
Application Amount | : | RMB 11,232 million |
Issue Amount | : | RMB 3,000 million |
Average accepted Coupon Rate | : | 2.44 per cent |
Highest accepted Coupon Rate (Bonds' Coupon) |
: | 2.52 per cent |
Lowest accepted Coupon Rate | : | 1.80 per cent |
Allocation Ratio | : | Approximately 65.22 per cent |
Tender Result | ||
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Tender Date | : | August 2, 2023 |
Bonds available for Tender | : | 2-year RMB Bonds |
Issue Number | : | BCMKFB23013 (Re-open) |
Issue and Settlement Date | : | August 4, 2023 |
Maturity Date | : | June 16, 2025 (or the closest coupon payment date) |
Coupon Rate | : | 2.20 per cent |
Application Amount | : | RMB 18,560 million |
Issue Amount | : | RMB 6,000 million |
Average Accepted Price | : | 100.14 |
Lowest Accepted Price | : | 99.97 |
Highest Accepted Price | : | 101.10 |
Allocation Ratio | : | Approximately 68.75 per cent |
Tender Result | ||
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Tender Date | : | August 2, 2023 |
Bonds available for Tender | : | 3-year RMB Bonds |
Issue Number | : | BCMKFB23014 (Re-open) |
Issue and Settlement Date | : | August 4, 2023 |
Maturity Date | : | June 16, 2026 (or the closest coupon payment date) |
Coupon Rate | : | 2.30 per cent |
Application Amount | : | RMB 12,622 million |
Issue Amount | : | RMB 3,000 million |
Average Accepted Price | : | 100.24 |
Lowest Accepted Price | : | 100.00 |
Highest Accepted Price | : | 101.96 |
Allocation Ratio | : | Approximately 38.18 per cent |
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