Beijing High-Tech Expo signs US$10.8b deals

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The 20th China Beijing International High-Tech Expo (CHITEC) ended in the Chinese capital on June 10, attracting more than 200,000 attendees. A total of 82 projects of technology trading and industrial cooperation contracts have been signed with the total amount of 73.326 billion yuan (about US$10.8 billion) during the three-day expo.

CHITEC, first launched in 1998, has witnessed the transformation of Chinese sci-tech innovation from the low-end industrial value chain to a higher sci-tech power in the past two decades. This year’s expo featured a number of technologically sophisticated projects such as top-notch Tiangong-2 and COMAC C919, graphene waterborne paint which is a technological breakthrough in the field, and QD image sensor and so on. These original achievement showcase that China is on course to become a world-class sci-tech powerhouse.

According to the organizing committee, deals in the aerospace industry, new generation of information technology and new material amounted to 49.5 billion yuan, while projects aimed at improving people’s lives totaled 20.8 billion yuan.

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